Testing of Interposer-Based 2.5D Integrated Circuits
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- Synopsis
- This book provides readers with an insightful guide to the design, testing and optimization of 2. 5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2. 5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2. 5D ICs a reality and commercially viable.
- Copyright:
- 2017
Book Details
- Book Quality:
- Publisher Quality
- ISBN-13:
- 9783319547145
- Publisher:
- Springer International Publishing, Cham
- Date of Addition:
- 03/29/17
- Copyrighted By:
- Springer
- Adult content:
- No
- Language:
- English
- Has Image Descriptions:
- No
- Submitted By:
- Bookshare Staff
- Usage Restrictions:
- This is a copyrighted book.