3D Microelectronic Packaging: From Architectures to Applications (2nd ed. 2021) (Springer Series in Advanced Microelectronics #64)

By: and

Sign Up Now! Already a Member? Log In
You must be logged into Bookshare to access this title. Learn about membership options, or view our freely available titles.

Copyright:
2021

Book Details

Book Quality:
Publisher Quality
ISBN-13:
9789811570902
Related ISBNs:
9789811570896
Publisher:
Springer Singapore, Singapore
Date of Addition:
Copyrighted By:
Springer
Adult content:
No
Language:
English
Has Image Descriptions:
No
Categories:
Nonfiction, Science, Technology
Submitted By:
Bookshare Staff
Usage Restrictions:
This is a copyrighted book.
Edited by:
Yan Li
Edited by:
Deepak Goyal

Reviews

No Rating Yet