Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium: EPITS 2022, 14-15 September, Langkawi, Malaysia (1st ed. 2023) (Springer Proceedings in Physics #289)
By: and and and
Sign Up Now!
Already a Member? Log In
You must be logged into Bookshare to access this title.
Learn about membership options,
or view our freely available titles.
- Synopsis
- This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials.
- Copyright:
- 2023
Book Details
- Book Quality:
- Publisher Quality
- ISBN-13:
- 9789811992674
- Related ISBNs:
- 9789811992667
- Publisher:
- Springer Nature Singapore
- Date of Addition:
- 08/03/23
- Copyrighted By:
- The Editor
- Adult content:
- No
- Language:
- English
- Has Image Descriptions:
- No
- Categories:
- Nonfiction, Science, Technology
- Submitted By:
- Bookshare Staff
- Usage Restrictions:
- This is a copyrighted book.
- Edited by:
- Mohd Arif Mohd Salleh
- Edited by:
- Dewi Suriyani Che Halin
- Edited by:
- Kamrosni Abdul Razak
- Edited by:
- Mohd Izrul Ramli
Reviews
Other Books
- by Mohd Arif Anuar Mohd Salleh
- by Dewi Suriyani Che Halin
- by Kamrosni Abdul Razak
- by Mohd Izrul Izwan Ramli
- in Nonfiction
- in Science
- in Technology