Recent Trends in VLSI and Semiconductor Packaging (1)
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- Synopsis
- The International conference on Semiconductor Materials packaging, AI&ML, Reconfigurable VLSI architectures for IoT, future Communication Technologies (“SMART-2024”) aimed to provide a platform for researchers, academicians, industry experts, and practitioners to exchange ideas, present research findings, and discuss emerging trends and challenges in the specified fields. “SMART-2024” seeked to foster collaboration, innovation, and knowledge dissemination by bringing together experts and stakeholders from diverse backgrounds to address key issues and explore new research directions. The conference targeted a diverse audience including researchers, academicians, scientists, engineers, technologists, industry professionals, students, policymakers, and other stakeholders interested in VLSI, IoT, AI-ML, communication systems, semiconductor packaging, hetero architecture devices, and Nano materials.
- Copyright:
- 2025
Book Details
- Book Quality:
- Publisher Quality
- Book Size:
- 650 Pages
- ISBN-13:
- 9781040361641
- Related ISBNs:
- 9781041017875, 9781041017868, 9781040361580, 9781003616399
- Publisher:
- CRC Press
- Date of Addition:
- 05/06/25
- Copyrighted By:
- selection and editorial matter, T. Vasudeva Reddy and K. Madhava Rao
- Adult content:
- No
- Language:
- English
- Has Image Descriptions:
- No
- Categories:
- Nonfiction, Computers and Internet
- Submitted By:
- Bookshare Staff
- Usage Restrictions:
- This is a copyrighted book.
- Edited by:
- T. Vasudeva Reddy
- Edited by:
- K. Madhava Rao