Handbook of Wafer Bonding

By: and and

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Synopsis
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies.This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
Copyright:
2012

Book Details

Book Quality:
Publisher Quality
ISBN-13:
9783527644230
Related ISBNs:
9783527326464
Publisher:
Wiley
Date of Addition:
Copyrighted By:
John Wiley & Sons
Adult content:
No
Language:
English
Has Image Descriptions:
No
Categories:
Nonfiction, Technology
Submitted By:
Bookshare Staff
Usage Restrictions:
This is a copyrighted book.

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